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Features
* Low-voltage and Standard-voltage Operation
- 1.8v (VCC = 1.8V to 3.6V) - 2.5v (VCC = 2.5V to 5.5V) Internally Organized 65,536 x 8 Two-wire Serial Interface Schmitt Triggers, Filtered Inputs for Noise Suppression Bidirectional Data Transfer Protocol 1 MHz (2.5V, 5.5V), 400 kHz (1.8V) Compatibility Write Protect Pin for Hardware and Software Data Protection 128-byte Page Write Mode (Partial Page Writes Allowed) Self-timed Write Cycle (5 ms Max) High Reliability - Endurance: 1,000,000 Write Cycles - Data Retention: 40 Years Lead-free/Halogen-free Devices 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead TSSOP, 8-ball dBGA2, and 8-lead Ultra Thin Small Array (SAP) Packages Die Sales: Wafer Form, Waffle Pack and Bumped Die
* * * * * * * * *
Two-wire Serial EEPROM
512K (65,536 x 8)
* * *
AT24C512B
with Three Device Address Inputs
Description
The AT24C512B provides 524,288 bits of serial electrically erasable and programmable read only memory (EEPROM) organized as 65,536 words of 8 bits each. The device's cascadable feature allows up to eight devices to share a common two-wire bus. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The devices are available in space-saving 8-pin PDIP, 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead TSSOP, 8-ball dBGA2 and 8-lead Ultra Thin SAP packages. In addition, the entire family is available in 1.8V (1.8V to 3.6V) and 2.5V (2.5V to 5.5V) versions.
Table 0-1.
Pin Name A0-A2 SDA SCL WP
Pin Configurations
Function Address Inputs Serial Data Serial Clock Input Write Protect
A0 A1 A2 GND
8-lead TSSOP
1 2 3 4 8 7 6 5 VCC WP SCL SDA
A0 A1 A2 GND
8-lead PDIP
1 2 3 4 8 7 6 5 VCC WP SCL SDA
8-ball dBGA2
VCC WP SCL SDA 8 7 6 5 1 2 3 4 A0 A1 A2 GND
8-lead Ultra Thin SAP
VCC WP SCL SDA 8 7 6 5 1 2 3 4 A0 A1 A2 GND
8-lead SOIC
A0 A1 A2 GND 1 2 3 4 8 7 6 5 VCC WP SCL SDA
Rev. 5297A-SEEPR-1/08
Bottom View Bottom View
Absolute Maximum Ratings*
Operating Temperature..................................-55C to +125C Storage Temperature .....................................-65C to +150C Voltage on Any Pin with Respect to Ground .................................... -1.0V to +7.0V Maximum Operating Voltage .......................................... 6.25V DC Output Current........................................................ 5.0 mA *NOTICE: Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Figure 0-1.
Block Diagram VCC
GND WP SCL SDA START STOP LOGIC
LOAD DEVICE ADDRESS COMPARATOR A2 A1 A0 R/W COMP
SERIAL CONTROL LOGIC
EN
H.V. PUMP/TIMING
DATA RECOVERY INC
LOAD
DATA WORD ADDR/COUNTER
X DEC
EEPROM
Y DEC
SERIAL MUX
DIN DOUT
DOUT/ACK LOGIC
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1. Pin Description
SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative edge clock data out of each device. SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is opendrain driven and may be wire-ORed with any number of other open-drain or open collector devices. DEVICE/PAGE ADDRESSES (A2, A1, A0): The A2, A1, and A0 pins are device address inputs that are hardwired (directly to GND or to Vcc) for compatibility with other AT24Cxx devices. When the pins are hardwired, as many as eight 512K devices may be addressed on a single bus system. (Device addressing is discussed in detail under "Device Addressing," page 8.) A device is selected when a corresponding hardware and software match is true. If these pins are left floating, the A2, A1, and A0 pins will be internally pulled down to GND. However, due to capacitive coupling that may appear during customer applications, Atmel (R) recommends always connecting the address pins to a known state. When using a pull-up resistor, Atmel recommends using 10k or less. WRITE PROTECT (WP): The write protect input, when connected to GND, allows normal write operations. When WP is connected directly to Vcc, all write operations to the memory are inhibited. If the pin is left floating, the WP pin will be internally pulled down to GND. However, due to capacitive coupling that may appear during customer applications, Atmel recommends always connecting the WP pins to a known state. When using a pull-up resistor, Atmel recommends using 10k or less.
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2. Memory Organization
AT24C512B, 512K SERIAL EEPROM: The 512K is internally organized as 512 pages of 128-bytes each. Random word addressing requires a 16-bit data word address. Table 2-1. Pin Capacitance(1) Applicable over recommended operating range from: TA = 25C, f = 1.0 MHz, VCC = +1.8V to +5.5V
Symbol CI/O CIN Note: Test Condition Input/Output Capacitance (SDA) Input Capacitance (A0, A1, SCL) 1. This parameter is characterized and is not 100% tested. Max 8 6 Units pF pF Conditions VI/O = 0V VIN = 0V
Table 2-2. DC Characteristics Applicable over recommended operating range from: TAI = -40C to +85C, VCC = +1.8V to +5.5V (unless otherwise noted)
Symbol VCC1 VCC2 ICC ICC ISB1 Parameter Supply Voltage Supply Voltage Supply Current Supply Current Standby Current VCC = 5.0V VCC = 5.0V VCC = 1.8V VCC = 3.6V Standby Current Input Leakage Current Output Leakage Current Input Low Level(1) Input High Level
(1)
Test Condition
Min 1.8 2.5 READ at 400 kHz WRITE at 400 kHz VIN = VCC or VSS
Typ
Max 3.6 5.5 2.0 3.0 1.0 3.0 2.0
Units V V mA mA A A A A A A V V V V
ISB2 ILI ILO VIL VIH VOL1 VOL2 Note:
VCC = 2.5V VCC = 5.5V VIN = VCC or VSS VOUT = VCC or VSS
VIN = VCC or VSS 0.10 0.05 -0.6 VCC x 0.7
6.0 3.0 3.0 VCC x 0.3 VCC + 0.5 0.2 0.4
Output Low Level Output Low Level
VCC = 1.8V VCC = 3.0V
IOL = 0.15 mA IOL = 2.1 mA
1. VIL min and VIH max are reference only and are not tested.
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Table 2-3. AC Characteristics (Industrial Temperature) Applicable over recommended operating range from TAI = -40C to +85C, VCC = +1.8V to +5.5V, CL = 100 pF (unless otherwise noted). Test conditions are listed in Note 2.
1.8-volt Symbol fSCL tLOW tHIGH ti tAA tBUF tHD.STA tSU.STA tHD.DAT tSU.DAT tR tF tSU.STO tDH tWR Endurance(1) Notes: Parameter Clock Frequency, SCL Clock Pulse Width Low Clock Pulse Width High Noise Suppression Time
(1)
2.5, 5.0-volt Max 400 Min Max 1000 0.4 0.4 100 50 0.05 0.5 0.25 0.25 0 100 0.3 300 0.3 100 0.25 50 5 1,000,000 5 0.55 Units kHz s s ns s s s s s ns s ns s ns ms Write Cycles
Min
1.3 0.6
Clock Low to Data Out Valid Time the bus must be free before a new transmission can start(1) Start Hold Time Start Set-up Time Data In Hold Time Data In Set-up Time Inputs Rise Time Inputs Fall Time
(1)
0.05 1.3 0.6 0.6 0 100
0.9
(1)
Stop Set-up Time Data Out Hold Time Write Cycle Time 25C, Page Mode, 3.3V
0.6 50
1. This parameter is ensured by characterization only. 2. AC measurement conditions: RL (connects to VCC): 1.3 k (2.5V, 5V), 10 k (1.8V) Input pulse voltages: 0.3 VCC to 0.7 VCC Input rise and fall times: 50 ns Input and output timing reference voltages: 0.5 VCC
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3. Device Operation
CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an external device. Data on the SDA pin may change only during SCL low time periods (see Figure 3-4 on page 8). Data changes during SCL high periods will indicate a start or stop condition as defined below. START CONDITION: A high-to-low transition of SDA with SCL high is a start condition which must precede any other command (see Figure 3-5 on page 8). STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition. After a read sequence, the stop command will place the EEPROM in a standby power mode (see Figure 3-5 on page 8). ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words. The EEPROM sends a zero during the ninth clock cycle to acknowledge that it has received each word. STANDBY MODE: The AT24C512B features a low power standby mode which is enabled: a) upon power-up and b) after the receipt of the STOP bit and the completion of any internal operations. Software Reset: After an interruption in protocol, power loss or system reset, any 2-wire part can be protocol reset by following these steps: (a) Create a start bit condition, (b) clock 9 cycles, (c) create another start bit followed by stop bit condition as shown below. The device is ready for next communication after above steps have been completed. Figure 3-1. Protocol Reset Condition
Start bit Dummy Clock Cycles Start bit Stop bit
SCL
1
2
3
8
9
SDA
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Figure 3-2. Bus Timing (SCL: Serial Clock, SDA: Serial Data I/O)
tF tHIGH tLOW tR
SCL
tSU.STA tHD.STA
tLOW
tHD.DAT
tSU.DAT
tSU.STO
SDA IN
tAA tDH tBUF
SDA OUT
Figure 3-3.
Write Cycle Timing (SCL: Serial Clock, SDA: Serial Data I/O)
SCL
SDA
8th BIT
ACK
WORDn twr STOP CONDITION
Note:
(1)
START CONDITION
1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle.
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Figure 3-4.
Data Validity
SDA
SCL DATA STABLE DATA CHANGE DATA STABLE
Figure 3-5.
Start and Stop Definition
SDA
SCL
START
STOP
Figure 3-6.
Output Acknowledge
SCL
1
8
9
DATA IN
DATA OUT
START
ACKNOWLEDGE
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4. Device Addressing
The 512K EEPROM requires an 8-bit device address word following a start condition to enable the chip for a read or write operation (see Figure 6-1 on page 10). The device address word consists of a mandatory "1", "0" sequence for the first four most significant bits as shown. This is common to all two-wire EEPROM devices. The 512K uses the three device address bits A2, A1, A0 to allow as many as eight devices on the same bus. These bits must compare to their corresponding hardwired input pins. The A2, A1 and A0 pins use an internal proprietary circuit that biases them to a logic low condition if the pins are allowed to float. The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if this bit is high and a write operation is initiated if this bit is low. Upon a compare of the device address, the EEPROM will output a "0". If a compare is not made, the device will return to a standby state. DATA SECURITY: The AT24C512B has a hardware data protection scheme that allows the user to Write Protect the whole memory when the WP pin is at VCC.
5. Write Operations
BYTE WRITE: A write operation requires two 8-bit data word addresses following the device address word and acknowledgment. Upon receipt of this address, the EEPROM will again respond with a "0" and then clock in the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a "0". The addressing device, such as a microcontroller, then must terminate the write sequence with a stop condition. At this time the EEPROM enters an internally-timed write cycle, tWR, to the nonvolatile memory. All inputs are disabled during this write cycle and the EEPROM will not respond until the write is complete (see Figure 6-2 on page 10). PAGE WRITE: The 512K EEPROM is capable of 128-byte page writes. A page write is initiated the same way as a byte write, but the microcontroller does not send a stop condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the microcontroller can transmit up to 127 more data words. The EEPROM will respond with a "0" after each data word received. The microcontroller must terminate the page write sequence with a stop condition (see Figure 6-3 on page 11). The data word address lower 7 bits are internally incremented following the receipt of each data word. The higher data word address bits are not incremented, retaining the memory page row location. When the word address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. If more than 128 data words are transmitted to the EEPROM, the data word address will "roll over" and previous data will be overwritten. The address roll over during write is from the last byte of the current page to the first byte of the same page. ACKNOWLEDGE POLLING: Once the internally-timed write cycle has started and the EEPROM inputs are disabled, acknowledge polling can be initiated. This involves sending a start condition followed by the device address word. The Read/Write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM respond with a "0", allowing the read or write sequence to continue.
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6. Read Operations
Read operations are initiated the same way as write operations with the exception that the Read/Write select bit in the device address word is set to "1". There are three read operations: current address read, random address read and sequential read. CURRENT ADDRESS READ: The internal data word address counter maintains the last address accessed during the last read or write operation, incremented by "1". This address stays valid between operations as long as the chip power is maintained. The address roll over during read is from the last byte of the last memory page, to the first byte of the first page. Once the device address with the Read/Write select bit set to "1" is clocked in and acknowledged by the EEPROM, the current address data word is serially clocked out. The microcontroller does not respond with an input "0" but does generate a following stop condition (see Figure 6-4 on page 11). RANDOM READ: A random read requires a "dummy" byte write sequence to load in the data word address. Once the device address word and data word address are clocked in and acknowledged by the EEPROM, the microcontroller must generate another start condition. The microcontroller now initiates a current address read by sending a device address with the Read/Write select bit high. The EEPROM acknowledges the device address and serially clocks out the data word. The microcontroller does not respond with a "0" but does generate a following stop condition (see Figure 6-5 on page 11). SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a random address read. After the microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When the memory address limit is reached, the data word address will roll over and the sequential read will continue. The sequential read operation is terminated when the microcontroller does not respond with a "0" but does generate a following stop condition (see Figure 6-6 on page 11). Figure 6-1. Device Address
1 MSB
0
1
0
A2
A1
A0
R/W LSB
Figure 6-2.
Byte Write
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Figure 6-3. Page Write
Figure 6-4.
Current Address Read
Figure 6-5.
Random Read
Figure 6-6.
Sequential Read
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Ordering Information
Ordering Code AT24C512B-PU (Bulk form only) AT24C512B-PU25 (Bulk form only) AT24C512BN-SH-B(1) (NiPdAu Lead Finish) AT24C512BN-SH-T(2) (NiPdAu Lead Finish) AT24C512BN-SH25-B AT24C512BN-SH25-T
(1)
Voltage 1.8 2.5 1.8 1.8 2.5 2.5 1.8 1.8 2.5 2.5 1.8 1.8 2.5 2.5 1.8 2.5 1.8 1.8
Package 8P3 8P3 8S1 8S1 8S1 8S1 8S2 8S2 8S2 8S2 8A2 8A2 8A2 8A2 8Y7 8Y7 8U2-1 Die Sale
Operation Range
(NiPdAu Lead Finish) (NiPdAu Lead Finish)
(2)
AT24C512BW-SH-B(1) (NiPdAu Lead Finish) AT24C512BW-SH-T(2) (NiPdAu Lead Finish) AT24C512BW-SH25-B
(1)
(NiPdAu Lead Finish)
AT24C512BW-SH25-T(2) (NiPdAu Lead Finish) AT24C512B-TH-B(1) (NiPdAu Lead Finish) AT24C512B-TH-T
(2)
Lead-free/Halogen-free/ Industrial Temperature (-40C to 85C)
(NiPdAu Lead Finish)
(1)
AT24C512B-TH25-B AT24C512B-TH25-T
(NiPdAu Lead Finish) (NiPdAu Lead Finish)
(2)
AT24C512BY7-YH-T(2) (NiPdAu Lead Finish) AT24C512BY7-YH25-T(2) (NiPdAu Lead Finish) AT24C512BU2-UU-T AT24C512B-W-11
(3) (2)
Industrial Temperature (-40C to 85C)
Notes:
1. "-B" denotes bulk 2. "-T" denotes tape and reel. SOIC = 4K per reel. TSSOP and dBGA2 = 5K per reel. SAP = 3K per reel. EIAJ = 2K per reel. 3. Available in tape and reel, and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please contact Serial Interface Marketing.
Package Type 8P3 8S1 8S2 8A2 8Y7 8U2-1 8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP) 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC) 8-lead, 0.200" Wide Plastic Gull Wing Small Outline Package (EIAJ SOIC) 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) 8-lead, 6.00 mm x 4.90 mm Body, Ultra Thin, Dual Footprint, Non-leaded, Small Array Package (SAP) 8-ball, die Ball Grid Array Package (dBGA2) Options -1.8 -2.5 Low-voltage (1.8V to 3.6V) Low-voltage (2.5V to 5.5V)
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7. Part marking scheme:
7.1 8-PDIP(1.8V)
Seal Year | Seal Week Y = SEAL YEAR 6: 2006 0: 2010 7: 2007 8: 2008 9: 2009 1: 2011 2: 2012 3: 2013 WW = SEAL WEEK 02 = Week 2 04 = Week 4 :: : :::: : :: : :::: :: 50 = Week 50 52 = Week 52 Lot Number to Use ALL Characters in Marking BOTTOM MARK No Bottom Mark
TOP MARK
| | | |---|---|---|---|---|---|---|---| A T M L U Y W W |---|---|---|---|---|---|---|---| 2 F B 1 |---|---|---|---|---|---|---|---| * Lot Number |---|---|---|---|---|---|---|---| | Pin 1 Indicator (Dot)
7.2
8-PDIP(2.5V)
Seal Year | Seal Week Y = SEAL YEAR 6: 2006 0: 2010 7: 2007 8: 2008 9: 2009 1: 2011 2: 2012 3: 2013 WW = SEAL WEEK 02 = Week 2 04 = Week 4 :: : :::: : :: : :::: :: 50 = Week 50 52 = Week 52 Lot Number to Use ALL Characters in Marking BOTTOM MARK No Bottom Mark
TOP MARK
| | | |---|---|---|---|---|---|---|---| A T M L U Y W W |---|---|---|---|---|---|---|---| 2 F B 2 |---|---|---|---|---|---|---|---| * Lot Number |---|---|---|---|---|---|---|---| | Pin 1 Indicator (Dot)
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7.3
8-SOIC(1.8V)
Seal Year | Seal Week Y = SEAL YEAR 6: 2006 0: 2010 7: 2007 8: 2008 9: 2009 1: 2011 2: 2012 3: 2013 WW = SEAL WEEK 02 = Week 2 04 = Week 4 :: : :::: : :: : :::: :: 50 = Week 50 52 = Week 52 Lot Number to Use ALL Characters in Marking BOTTOM MARK No Bottom Mark
TOP MARK
| | | |---|---|---|---|---|---|---|---| A T M L H Y W W |---|---|---|---|---|---|---|---| 2 F B 1 |---|---|---|---|---|---|---|---| * Lot Number |---|---|---|---|---|---|---|---| | Pin 1 Indicator (Dot)
7.4
8-SOIC(2.5V)
Seal Year | Seal Week Y = SEAL YEAR 6: 2006 0: 2010 7: 2007 8: 2008 9: 2009 1: 2011 2: 2012 3: 2013 WW = SEAL WEEK 02 = Week 2 04 = Week 4 :: : :::: : :: : :::: :: 50 = Week 50 52 = Week 52 Lot Number to Use ALL Characters in Marking BOTTOM MARK No Bottom Mark
TOP MARK
| | | |---|---|---|---|---|---|---|---| A T M L H Y W W |---|---|---|---|---|---|---|---| 2 F B 2 |---|---|---|---|---|---|---|---| * Lot Number |---|---|---|---|---|---|---|---| | Pin 1 Indicator (Dot)
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7.5 8-TSSOP(1.8V)
Pin 1 Indicator (Dot) | |---|---|---|---| * H Y W W |---|---|---|---|---| 2 F B 1 * |---|---|---|---|---| BOTTOM MARK |---|---|---|---|---|---|---| C 0 0 |---|---|---|---|---|---|---| A A A A A A A |---|---|---|---|---|---|---| <- Pin 1 Indicator Y = SEAL YEAR 6: 7: 8: 9: 2006 2007 2008 2009 0: 1: 2: 3: 2010 2011 2012 2013 WW = SEAL WEEK 02 04 :: :: = = : : Week Week :::: :::: 2 4 : ::
TOP MARK
50 = Week 50 52 = Week 52
Country of origin
7.6
8-TSSOP(2.5V)
Pin 1 Indicator (Dot) | |---|---|---|---| * H Y W W |---|---|---|---|---| 2 F B 2* |---|---|---|---|---| Y = SEAL YEAR 6: 7: 8: 9: 2006 2007 2008 2009 0: 1: 2: 3: 2010 2011 2012 2013 WW = SEAL WEEK 02 04 :: :: = = : : Week Week :::: :::: 2 4 : ::
TOP MARK
50 = Week 50 52 = Week 52
BOTTOM MARK |---|---|---|---|---|---|---| C 0 0 |---|---|---|---|---|---|---| A A A A A A A |---|---|---|---|---|---|---| <- Pin 1 Indicator
Country of origin
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7.7
8-Ultra Thin SAP (1.8V)
Seal Year | Seal Week | | | |---|---|---|---|---|---|---|---| A T M L H Y W W |---|---|---|---|---|---|---|---| 2 F B 1 |---|---|---|---|---|---|---|---| Lot Number |---|---|---|---|---|---|---|---| * | Pin 1 Indicator (Dot) Y= 6: 7: 8: 9: SEAL YEAR 2006 0: 2010 2007 1: 2011 2008 2: 2012 2009 3: 2013 WW = SEAL WEEK 02 = Week 2 04 = Week 4 :: : :::: : :: : :::: :: 50 = Week 50 52 = Week 52
TOP MARK
7.8
8-Ultra Thin SAP (2.5V)
Seal Year | Seal Week | | | |---|---|---|---|---|---|---|---| A T M L H Y W W |---|---|---|---|---|---|---|---| 2 F B 2 |---|---|---|---|---|---|---|---| Lot Number |---|---|---|---|---|---|---|---| * | Pin 1 Indicator (Dot) Y= 6: 7: 8: 9: SEAL YEAR 2006 0: 2010 2007 1: 2011 2008 2: 2012 2009 3: 2013 WW = SEAL WEEK 02 = Week 2 04 = Week 4 :: : :::: : :: : :::: :: 50 = Week 50 52 = Week 52
TOP MARK
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7.8 dBGA2
TOP MARK LINE 1-------> LINE 2-------> 2FBU YMTC |<-- Pin 1 This Corner
P = Country of Origin Y = ONE DIGIT YEAR CODE 4: 2004 7: 2007 5: 2005 8: 2008 6: 2006 9: 2009 M = SEAL MONTH (USE ALPHA DESIGNATOR A-L) A = JANUARY B = FEBRUARY " " """"""" J = OCTOBER K = NOVEMBER L = DECEMBER
TC = TRACE CODE (ATMEL LOT NUMBERS TO CORRESPOND WITH ATK TRACE CODE LOG BOOK)
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8. Package Information U2-1 - dBGA2
A1 BALL PAD CORNER D
5.
b
E
A1
TOP VIEW
A2
A1 BALL PAD CORNER
A
2
1
SIDE VIEW
A B
e
C D
(e1)
d (d1)
BOTTOM VIEW
8 SOLDER BALLS
COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE
A A1 A2 b D E
e e1
0.81 0.15 0.40 0.25
d
5. Dimension 'b' is measured at the maximum solder ball diameter.
d1
0.91 1.00 0.20 0.25 0.45 0.50 0.30 0.35 2.35 BSC 3.73 BSC 0.75 BSC 0.74 REF 0.75 BSC 0.80 REF
6/17/03
This drawing is for general information only.
TITLE
R
1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906
DRAWING NO.
REV. A
8U2-1, 8-ball, 2.35 x 3.73 mm Body, 0.75 mm pitch, Small Die Ball Grid Array Package (dBGA2)
PO8U2-1
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8P3 - PDIP
E E1
1
N
Top View
c eA
End View
D e D1 A2 A
SYMBOL
COMMON DIMENSIONS (Unit of Measure = inches) MIN - NOM - MAX NOTE
A A2 b b2 b3 c D
0.210 0.195 0.022 0.070 0.045 0.014 0.400
-
2
0.115 0.014 0.045 0.030 0.008 0.355 0.005 0.300 0.240
0.130 0.018 0.060 0.039 0.010 0.365
-
5 6 6
3 3 4 3
b2 b3
4 PLCS
L
D1 E E1 e eA L
b
0.310 0.250 0.100 BSC 0.300 BSC
0.325 0.280
Side View
4 0.150 2
0.115
0.130
Notes:
1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional information. 2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. 3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch. 4. E and eA measured with the leads constrained to be perpendicular to datum. 5. Pointed or rounded lead tips are preferred to ease insertion. 6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
01/09/02 2325 Orchard Parkway San Jose, CA 95131 TITLE 8P3, 8-lead, 0.300" Wide Body, Plastic Dual In-line Package (PDIP) DRAWING NO. 8P3 REV. B
R
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8S1 - JEDEC SOIC
C
1
E
E1
N
L
Top View End View
e B A
SYMBOL COMMON DIMENSIONS (Unit of Measure = mm) MIN 1.35 0.10 0.31 0.17 4.80 3.81 5.79 NOM - - - - - - - 1.27 BSC 0.40 0 - - 1.27 8 MAX 1.75 0.25 0.51 0.25 5.00 3.99 6.20 NOTE
A1
A A1 B C
D
D E1 E
Side View
e L
Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
10/7/03 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TITLE 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) DRAWING NO. 8S1 REV. B
R
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5297A-SEEPR-1/08
AT24C512B
8S2 - EIAJ SOIC
C
1
E
E1
L
N
TOP VIEW
e A
SYMBOL
END VIEW
b
COMMON DIMENSIONS (Unit of Measure = mm) MIN NOM MAX NOTE
A1
A A1 b C
1.70 0.05 0.35 0.15 5.13 5.18 7.70 0.51 0 1.27 BSC
2.16 0.25 0.48 0.35 5.35 5.40 8.26 0.85 8 4 2, 3 5 5
D
D E1 E
SIDE VIEW
Notes: 1. 2. 3. 4. 5.
L e
This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information. Mismatch of the upper and lower dies and resin burrs aren't included. It is recommended that upper and lower cavities be equal. If they are different, the larger dimension shall be regarded. Determines the true geometric position. Values b,C apply to plated terminal. The standard thickness of the plating layer shall measure between 0.007 to .021 mm.
4/7/06 TITLE 8S2, 8-lead, 0.209" Body, Plastic Small Outline Package (EIAJ) DRAWING NO. REV. D
R
2325 Orchard Parkway San Jose, CA 95131
8S2
21
5297A-SEEPR-1/08
8A2 - TSSOP
3 21
Pin 1 indicator this corner
E1
E
L1
N L
Top View
End View
COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN 2.90 NOM 3.00 6.40 BSC 4.30 - 0.80 0.19 4.40 - 1.00 - 0.65 BSC 0.45 0.60 1.00 REF 0.75 4.50 1.20 1.05 0.30 4 3, 5 MAX 3.10 NOTE 2, 5
b
A
D E E1 A
e D
A2
A2 b e
Side View
L L1
Notes:
1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. 5. Dimension D and E1 to be determined at Datum Plane H. 5/30/02
R
2325 Orchard Parkway San Jose, CA 95131
TITLE 8A2, 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
DRAWING NO. 8A2
REV. B
22
AT24C512B
5297A-SEEPR-1/08
AT24C512B
8Y7 - UTSAP
PIN 1 INDEX AREA
A
PIN 1 ID
D E1
D1
L
E A
A1
b
e e1
COMMON DIMENSIONS (Unit of Measure = mm)
SYMBOL
MIN - 0.00 5.80 4.70 3.30 3.90 0.35
NOM - - 6.00 4.90 3.40 4.00 0.40 1.27 TYP 3.81 REF
MAX 0.60 0.05 6.20 5.10 3.50 4.10 0.45
NOTE
A A1 D E D1 E1 b e e1 L
0.50
0.60
0.70
10/13/05 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TITLE 8Y7, 8-lead (6.00 x 4.90 mm Body) Ultra-Thin SOIC Array Package (UTSAP) Y7 DRAWING NO. 8Y7 REV. B
R
23
5297A-SEEPR-1/08
8U2-1 - dBGA2
A1 BALL PAD CORNER D
5.
b
E
A1
TOP VIEW
A2
A1 BALL PAD CORNER
A
2
1
SIDE VIEW
A B
e
C D
(e1)
d (d1)
BOTTOM VIEW
8 SOLDER BALLS
COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE
A A1 A2 b D E
e e1
0.81 0.15 0.40 0.25
d
5. Dimension 'b' is measured at the maximum solder ball diameter.
d1
0.91 1.00 0.20 0.25 0.45 0.50 0.30 0.35 2.35 BSC 3.73 BSC 0.75 BSC 0.74 REF 0.75 BSC 0.80 REF
6/17/03
This drawing is for general information only.
TITLE
R
1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906
DRAWING NO.
REV. A
8U2-1, 8-ball, 2.35 x 3.73 mm Body, 0.75 mm pitch, Small Die Ball Grid Array Package (dBGA2)
PO8U2-1
24
AT24C512B
5297A-SEEPR-1/08
AT24C512B
Revision History
Doc. Rev. 5297A Date 1/2008 Comments AT24C512B product with date code 2008 work week 14 (814) or later supports 5Vcc operation Initial document release
25
5297A-SEEPR-1/08
Headquarters
Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600
International
Atmel Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-enYvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581
Product Contact
Web Site www.atmel.com Technical Support s_eeprom@atmel.com Sales Contact www.atmel.com/contacts
Literature Requests www.atmel.com/literature
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL'S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL'S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel's products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life.
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5297A-SEEPR-1/08

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